bga x ray inspection system
"
閉められていた管SMT Xは自動車電子工学モジュールのための装置AX8200 8Wを放射する
Applying 5micro closed tube AX8200 X-ray for Automotive Electronics Modules quality defects control Other Special Industries. Item Definition Specs System Parameters Size 1080(L)X1180(W)X1730(H)mm Weight 1150kg Power 220AC/50HZ Power Consumption 0.8KW X-Ray Tube Type Closed Max.Voltage 90kv/100kv Max.Power 8W Spot Size 5μm X-Ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600X Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area
反対のSMT BGAの点検X光線の破片440mmのトンネルのセリウム
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
EMS SMT PCBA QFPのためのUnicomp AX8200max FPDの探知器X光線機械
CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
5umワイヤー馬具のための高リゾリューション90KV Unicomp X光線FPDの探知器
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
高仕様電子ボード 2D & 2.5D X線機械 Unicomp AX9100MAX 360度回転テーブル BGA と PCB 検査
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
FPDの探知器1kW 90KV EMSの点検X光線装置
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • Multi-function workstation with
Unicomp AX9100max X-ray Machine For Cylindrical Power Cell
Unicomp AX9100max X-ray Machine For Cylindrical Power Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp X-ray AX9100max Functions and Features Functions and features of Unicomp X-ray AX9100max Inspection Image Sample inspection image from Unicomp X-ray AX9100max Technical Parameters and
Unicompの自動地図を描くことを用いるオフ・ラインAX7900無効の自動測定をはんだ付けするレントゲン撮影機およびBGA QFN LED
Unicomp offline AX7900 X-ray machine with auto-mapping and BGA QFN LED soldering Void auto measurement Specifications of Unicomp offline AX7900 X-ray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat
SMT EMS BGA ICケーブル及びワイヤー質の点検のための眺めを傾けるFPDのUnicompの終わりの管AX7900のX線システム
Unicomp close tube AX7900 X-ray system with FPD tilting view for SMT EMS BGA IC Cable & wires qualtiy inspection Specifications of AX7900 X-ray system: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
