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品質 PCBA の欠陥検出 Unicomp AX7900 のための FPD 90KV X 線検査システム 工場

PCBA の欠陥検出 Unicomp AX7900 のための FPD 90KV X 線検査システム

FPD 90KV X Ray Inspection System for PCBA defect Detection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption

品質 ワイヤー馬具の欠陥の検出のためのFPD 90KV X光線の点検装置 工場

ワイヤー馬具の欠陥の検出のためのFPD 90KV X光線の点検装置

FPD 90KV X Ray Inspection System for Wire Harness defects Detection Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area

品質 ワイヤー馬具の質の検出AX7900の電子工学のUnicomp X光線装置 工場

ワイヤー馬具の質の検出AX7900の電子工学のUnicomp X光線装置

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

品質 X光線の走査器機械AX8200 100KVForコネクターの馬具の地図を描くCNC 工場

X光線の走査器機械AX8200 100KVForコネクターの馬具の地図を描くCNC

Chinese leading X-ray Inspection System AX8200 for Connectors Harness Defects inspection with CNC MappingThe AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring

品質 マイクロ焦点X光線の半導体の点検装置のインライン第2 工場

マイクロ焦点X光線の半導体の点検装置のインライン第2

Factory directly supply microfocus inline 2D X-ray machine to check Electronic Semiconductor IGBT with automatic defect recognition Technical Parameters and SpecificationsSystem SummaryFootprint2595(W)×1392(D)×1992(H)mmMachine Weight1900 kg (X-Ray) / 700kg (Conveyor)Power SupplyAC 110~220V, 50/60HzPlywood Packing Size180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor)Packing Weight2000kg (X-Ray) / 800kg (Conveyor)Power Consumption3.5 kWX-Ray TubeTube TypeSealedMa

品質 内部電子工学のコンデンサーのための実時間2.5DX光線の点検機械AX7900 工場

内部電子工学のコンデンサーのための実時間2.5DX光線の点検機械AX7900

Real Time 2.5D X-Ray Machine AX7900 for Electronics Capacitor Inner Defects Inspection Description of AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area

品質 自動測定と点検するSemiconのleadframeの質のための2.5D 110kv X光線機械Unicomp AX8500 工場

自動測定と点検するSemiconのleadframeの質のための2.5D 110kv X光線機械Unicomp AX8500

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

品質 高リゾリューションの電子工学X光線機械、IC LEDは電子部品の探知器を切ます 工場

高リゾリューションの電子工学X光線機械、IC LEDは電子部品の探知器を切ます

IC LED Clips Electronic Components Detector Electronics X Ray Machine X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray. (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB

品質 110KV 高解像度X線 Unicomp AX8300 非破壊的なBGA溶接関節分析のために 工場

110KV 高解像度X線 Unicomp AX8300 非破壊的なBGA溶接関節分析のために

High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints. Our Service Commitment Response to inquiries within 12 hours Direct manufacturer pricing with competitive rates Comprehensive one-year warranty with free