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品質 倉庫の目録のためのインラインSMT SMD X光線の構成の破片のカウンターのX線 工場

倉庫の目録のためのインラインSMT SMD X光線の構成の破片のカウンターのX線

Inline SMT SMD X ray Component Chip counter X-ray for warehouse inventory This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the

品質 Unicompの技術オンラインX光線の破片のカウンターの電子工学の部品LX6000 工場

Unicompの技術オンラインX光線の破片のカウンターの電子工学の部品LX6000

Unicomp Technology Online Electronics Components Chip Counter LX6000 Features: • Fast speed and High ac curate Chip counting, reducing labor cost • No chip damage or lost with non-contact counting • Compatible of30-450mm tape reel • Auto matic link with ERP & Shop Floor System • Shielded cabinet protection to guarantee No leakage of X-ray • Counting Speed: 8S/ Reel • Inspection Accuracy: >99.8% • Min. Package: 0201 • One-button operation, automatic counting • Specially for

品質 SMT PCBA BGAのはんだ付けする点検のためのUnicomp AX9100の130kV microfocusのX線 工場

SMT PCBA BGAのはんだ付けする点検のためのUnicomp AX9100の130kV microfocusのX線

130kV microfocus X-ray of Unicomp AX9100 for SMT PCBA BGA soldering Inspection Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery

品質 TWSのリチウム ボタンの細胞の質の点検のためのUnicompのmicrofocus X光線機械 工場

TWSのリチウム ボタンの細胞の質の点検のためのUnicompのmicrofocus X光線機械

Unicomp microfocus X Ray Machine for TWS Lithium Button Cell Quality Check Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery

品質 PCBA BGA QFN LEDのはんだ付けする空間を点検するために眺めを傾けるFPD 55°の5μm Microfocus X光線 工場

PCBA BGA QFN LEDのはんだ付けする空間を点検するために眺めを傾けるFPD 55°の5μm Microfocus X光線

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

品質 無効の測定をはんだ付けするLed PCBAのためのUnicomp 130kVのmicrofocusのX線AX9100 工場

無効の測定をはんだ付けするLed PCBAのためのUnicomp 130kVのmicrofocusのX線AX9100

Unicomp 130kV microfocus X-ray AX9100 for Led PCBA soldering Void measurement Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery

品質 高いresolutinのイメージのLEDのはんだ付けする品質管理のための近い管2.5Dのレントゲン撮影機AX9100 工場

高いresolutinのイメージのLEDのはんだ付けする品質管理のための近い管2.5Dのレントゲン撮影機AX9100

Close tube 2.5D X-ray Machine AX9100 for LED soldering quality control with high resolutin images Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging

品質 ICの破片および部品の偽造の点検のためのレントゲン撮影機の元の製造業者 工場

ICの破片および部品の偽造の点検のためのレントゲン撮影機の元の製造業者

Original Manufacturer of X-ray machine for IC chips and component counterfeit inspection Specifications of Xray machine AX7900: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

品質 PCBA BGAのはんだ付けする空間の点検のための高リゾリューションFPDの90KV 5umのmicrofocusのX線システム 工場

PCBA BGAのはんだ付けする空間の点検のための高リゾリューションFPDの90KV 5umのmicrofocusのX線システム

90KV 5um microfocus X-ray system with high resolution FPD for PCBA BGA soldering void checking​ Specifications of SMT Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel