industrial inspection systems
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金属製品のための産業NDT X光線機械UNC160内部欠陥の点検
Industrial NDT X-Ray inspection machine UNC160 specialized in internal defect inspection for Metal products Applications of NDT X-ray Machine UNC160: ● Cast parts and Pressure Vessels ● Steel pipe, Cylinder, and Wood ● Epoxy Resin Defect Detection ● Wheel, Tires, and Metal parts FAQ: 1. How about the package? Is it safe during the delivery? All X-ray inspection machine is packed with standard wooden solid carton. It is safe when shipping. 2. Do you provide the Warranty? How
CE/FDA認定 FPD 90KV コンデンサータの欠陥検出のためのX線検査システム
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
精密なX線検査PCB制御X線漏れ 1uSv/h電圧 0-110kV 調節可能
X-Ray Inspection for PCB Quality Control Application of SMT X-Ray machine Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of Desktop X-ray machine Large Size Inspection Table with 360° rotation Laser Locator for Precise Location Maganification (1000X) Accurate Control, CNC Programming Automatic Positioning FPD 55°
高精細度 2.5D イメージング重複ボイド BGA X 線 AX9100 UNICOMP SMT アセンブリ検査装置
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void detection capabilities for BGA components. Key Features 130KV 7μm X-Ray tube for precise imaging High-speed, high-resolution FPD with millions of pixels 1000X magnification with high
全方位ボンドワイヤ検査 IC X線 AX9100 UNICOMP 精密部品試験機
Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
0.2mm 高感度ユニコンプ UNX6030 牛肉・鶏肉・食肉用 X 線検査機
UNX6030-N X-ray Inspection Machine The UNX6030-N is a compact X-ray inspection system specifically engineered for lightweight, small-bag packaged products. Optimized with advanced detection algorithms for low-density and thin-layer materials, this model excels at identifying and rejecting physical contaminants that traditional metal detectors often miss. Core Application Areas Confectionery & Snacks: Chocolates, hard/soft candies, biscuits, baked bread, and extruded potato
高拡大PCBX線機器 Unicomp AX9100MAX 電子IC部品の結合線検査
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
電子工学SMT BGAのX線の検査システム130KV CSP LED AX9100、1900kg
Electronics SMT BGA X-ray Detection Equipment 130KV CSP LED AX9100 Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7 axis linkage, 70 degree tilt detection. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ●
産業SMTのためのAC 110~220V Bga点検装置のこんにちは決断FPDの探知器
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor, Packaging components, Battery Industry, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Multi-function DXI image processing system, CNC programmable detection X-ray tube & detector automatic lifting and descending, with convenient
