industrial x ray systems
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Unicomp SMD PCBA X光線の破片のカウンター440mmのトンネルLCDのモニター
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
5umワイヤー馬具のための高リゾリューション90KV Unicomp X光線FPDの探知器
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
CNCのプログラム可能な点検のためのUnicomp AX8200Max X光線機械6軸線のマニピュレーター
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
SMT BGA QFNの空間のための5um 90kV X光線の走査器機械Unicomp AX8200MAX
90kV 5um microfocus Xray machine Unicomp AX8200MAX for SMT BGA QFN voids measurement with automatic inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
160KVアルミニウム車輪のためのインラインNDT X光線機械レントゲン写真術NDT装置
Unicomp Technology 160KV Inline NDT X-Ray Radiograpy system for aluminum wheel casting inspection Technical Data X-Ray Machine Dimensions:5430mmx2050mmx2410mm(L*W*H) Weight: 5T Detection range: 13~26" Load weight: 50KG Work environment: 5-40° ≦85﹪HR Install power: 380V±10％ 50HZ X-Ray Tube Voltage : 160KV Power: 800W/1800W Focal Spot Size: 0.5mm FPD Detector Detector Size: 250mm×300mm Pixel matrix: 1792mm*2176mm Pixel size: 139μm Frame rate: 9 fps(1x1)30 fps(2 x 2) Unicomp
5軸線CNC第2自動X光線機械Unicomp UNC225のレントゲン写真術の管の点検
5 Axis automatic CNC 2D X-Ray machine Unicomp UNC225 Radiography system for pipes welded seams quality testing Technical Dat Attribute Respective Value Maximum penetration(FE) 150mm/25mm Equipment weight 5T System Dimension 2230mm*1582mm*2478mm(L*W*H) X-ray Tube 225KV Power 640W/1600W Pixel Pitch 139μm Focal size 1.0mm/3.0mm Image Area 250mm x 300mm Non Destructive Testing (NDT) is an important part of industrial quality management. Much Digital Radiography (DR) standards
金属/ガラス/石の点検のためのUNX4015Nの食糧X光線の検出装置
UNX4015N Food X Ray Detection Equipment for Metal/Glass/Stone Checking Application UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features Easy to Operate: one button start&stop, optional default product Provide High precision automatic foreign detection, It can
電子部品の内部欠陥検査のためのUnicomp X線システム AX9100max
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
X線システム AX9100max 画像超解像度再構築アルゴリズム
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
