pcb inspection system
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乾燥した共同検出および分析のための高いオートメーションのBga X光線機械
Dry joint detection and analysis BGA X-Ray Inspection Machine X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. ( Offline X - Ray series ) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm
BGA QFNのはんだ付けすることのためのインラインSPCの電子工学X光線機械LX2000 FPCの分析
Fully automatic Inspection and Analysing Inline AXI LX2000 X-ray for BGA , QFN soldering void inspection one FPC Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max.
FPC SMTのはんだ付けすることのためにプログラム可能なBGA QFN CSP X光線装置LX2000 CNC
LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed
PCBA BGA QFN LEDのはんだ付けする空間を点検するために眺めを傾けるFPD 55°の5μm Microfocus X光線
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
CNC機能のUnicomp X光線60°の傾きの動きをつける車
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
CSP LED X光線機械100KV半導体のための閉鎖した管のフリップ・チップAX8500
Closed Tube Type AX8500 X Ray Machine for semiconductor Lead frame wiring bonding quality inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
EMS SMTの電子工学X光線機械90kV FPD探知器Unicomp
EMS SMT Electronics X Ray Machine 90kV FPD Detector Unicomp Original manufacturer SMT Equipment Electronics X Ray Machine on IC chips wire Analysis Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging
高リゾリューションの電子工学X光線機械、IC LEDは電子部品の探知器を切ます
IC LED Clips Electronic Components Detector Electronics X Ray Machine X-ray Inspecting Features: (1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray. (2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB
退潮の分析SMT/EMS X光線機械、産業検査システムをはんだ付けして下さい
Metal X Ray Machine Solder reflow analysis for PCB / BGA / LED X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power
