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pcb x ray inspection

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品質 高仕様電子ボード 2D & 2.5D X線機械 Unicomp AX9100MAX 360度回転テーブル BGA と PCB 検査 工場

高仕様電子ボード 2D & 2.5D X線機械 Unicomp AX9100MAX 360度回転テーブル BGA と PCB 検査

It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight

品質 中国Unicomp AX8200 BGA/IC/PCBは工場価格のレントゲン撮影機を閉めた 工場

中国Unicomp AX8200 BGA/IC/PCBは工場価格のレントゲン撮影機を閉めた

Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the

品質 Semiconの破片の内部の欠陥の点検のための高リゾリューションのレントゲン撮影機AX8200MAX 工場

Semiconの破片の内部の欠陥の点検のための高リゾリューションのレントゲン撮影機AX8200MAX

High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic

品質 チップセットの欠陥の検出のためのHD PFDの検査システムが付いている中国Unicomp 90KVのX線 工場

チップセットの欠陥の検出のためのHD PFDの検査システムが付いている中国Unicomp 90KVのX線

China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming

品質 130KV マイクロンフォーカススポットサイズチューブX線機 Unicomp AX9100 改良モデル AX9100MAX 複合コンピュータ付き PCB&BGA検査 工場

130KV マイクロンフォーカススポットサイズチューブX線機 Unicomp AX9100 改良モデル AX9100MAX 複合コンピュータ付き PCB&BGA検査

It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4

品質 電子工学の構成の偽造の点検のためのUnicomp 90kV 5um Microfocus X光線の管 工場

電子工学の構成の偽造の点検のためのUnicomp 90kV 5um Microfocus X光線の管

Unicomp 90kV 5um Microfocus X-ray Tube for Electronics Component Counterfeit Inspection Key Parameter Max. Tube Voltage: 90kV Max. Tube Power: 8W Min. Spot Size:

品質 測定の地図を描くオフ・ラインAX8200Max SMT EMS X光線機械自動車 工場

測定の地図を描くオフ・ラインAX8200Max SMT EMS X光線機械自動車

Offline AX8200Max SMT EMS X Ray Machine Auto Mapping Measurement Unicomp offline AX8200Max X-ray with auto-mapping and measurement for BGA QFN LED soldering Void Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot

品質 CNCプログラム可能な自動検査 エレクトロニクスX線機械 Unicomp AX7900 傾斜角60° 工場

CNCプログラム可能な自動検査 エレクトロニクスX線機械 Unicomp AX7900 傾斜角60°

CNC programable automatic inspection Electronics X-ray machine Unicomp AX7900 with tilting angle 60°for used phone inspection Description of IC X Ray machine AX7900: It is broadly utilized in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpoint

品質 3.5kW LED棒中の質の点検のためのインラインX光線機械ADRの検出システム 工場

3.5kW LED棒中の質の点検のためのインラインX光線機械ADRの検出システム

LED bar Inline X-Ray ADR Detection System for Inside Quality Inspection Specifications Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage