x ray equipment
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容器のボイラー計算機制御、AC220Vを用いる携帯用NDT X光線の欠陥の探知器
Vessel Boiler Portable NDT X-ray Industrial Flaw Detector System Used in Mexico Controller (1)The special design of high frequency technology can avoid the interference by power spikes.Even though the voltage changes,it can still work. (2)All the signal wires in the controller are imported from South Korea to improve the quality. (3)Take the isolation technology of the low voltage and the high voltage to ensure the controller working steady. (4)Posses the reliable "time
AX8500 SMT/EMS X光線機械、X線の点検装置は管のタイプを閉めました
AX8500 Metal X Ray Machine for Micro BGA / chip on chop analysis Item Definition Specs Motion Control System Motion Control Mode Mouse&Joystick&Keyboard Max.Load Dimension 500x500mm Max.Detection Dimension 350x450mm Tilt Detection Angle 60° X-Ray System Tube Type Closed Voltage/Current 100kv/200μA Focal Spot Size 5μm FPD Detector FPD Physical & Image Processing Parameters Length x Width x Height 1250 x 1300 x 1900 mm Weight 1500 kg Power 2kW System Magnification 500 x Leakage
100KV中の質の点検のためのインラインX光線ADRの検出システムBGA EMS
Electronics SMT Cabinet Unicomp X-Ray Inspection System LX8500 Failure Analysis Features: ● Real-time image. ● 1000X system magnification. ● 100KV 5μm X-Ray tube. ● Modular design with In-line expansibility. ● Economical and Practical. ● FPD Detector. ● 6 axis linkage system. ● X-ray tube and FPD simultaneously tilt ±35°. Applications: ● LED,SMT,BGA,CSP,Flip Chip Inspection. ● Semiconductor,Packaging components,Battery Industry. ● Electronic components, Auto parts, Photovolta
自動測定と点検するSemiconのleadframeの質のための2.5D 110kv X光線機械Unicomp AX8500
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
X線装置 Unicomp AX7900 For EMS SMT PCBA BGA QFN CSP
CE FDA compliance x ray machine Unicomp AX7900 for EMS SMT PCBA BGA QFN CSP soldering Void checking Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
3umはSMT BGA CSPのための管1.6kW X光線機械を閉めた
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
LCDは1.0kW X光線の点検機械Unicomp AX8200 BGAの点検を表示する
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
CSP EMS BGAのための3µM Microfocusの管X光線機械AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
220VAC CNCのプログラム可能な電子工学X光線機械5um 90kV AX8200
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L
