x ray machine for manufacturing
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電源消費量1.0KWのPCB用X線検査装置 1280L x1220W x1615H mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Inspection Table of Large Dimensions, Laser Pinpointing for Exact Positioning Precise Control
電子産業 電子産業 線 1280x1220x1615mm の X線検査装置
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision
電子工学X光線の走査器機械インライン装置の生産ライン
Electronics X-ray Machine Inline Equipment Production Line in Asia High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for multiple applications including; PCBA, Semiconductor, Encapsulated Components, and Solar Cell just to name a few. Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power
高性能X光線の破片のカウンター、X光線の検査システム機械CX6000
Metal X Ray Component Counter Inspection System Machine CX6000 This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classification of
カートリッジ ヒーターのためのFPD 130kV X光線の点検機械
Application Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point
耐久X光線の破片のカウンター、Emsの目録企業4.0を数える電子工学X光線機械部品
SMD Chip Electronic Component Unicomp X ray Counter Inspection System This equipment is mainly used for the rapid counting of the production of reel materials, the material type includes all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of materials in accordance with the classifica
DXIの映像処理システムが付いているキャビネットのUnicompのX線装置220AC/50Hz
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
ゴルフクラブリアルタイム品質チェックX線検出システム6KW139μmピクセルサイズ
Metal Gas X Ray Machine 160KV Auto Parts NDT Machine in Cambodia Our industrial solutions have a wide range of advantages Sophisticated proprietary image analyzing algorithms which allow to realize reliable automatic detection systems of non-conformities. Statistics, computer assisted measurement, post-analysis, remote workstations, archiving, integration into customer’s network and production management systems. Modular design, broad range of accessories and options for
SemiconのためのSMT BGA X光線の検出装置のフリップ・チップFPDの探知器130KV
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
