x ray metal inspection
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ハンドルの投げるひびの気孔率の欠陥の点検のためのUnicompのレントゲン写真術NDT X光線機械
Unicomp Radiography NDT X-ray Machine for Steering Wheel casting Crack Porosity Flaw Checking System Parameters Dimensions 2100mm*1549mm*2468mm(L*W*H) Equipment weight 3.5T Power 6KW Maximum penetration(AL/FE) 100mm/20mm Detection range Φ500*800mm Load weight 50kg Work environment 5-40° ≤80%HR Install power Three-phase five-wire system AC380V X-ray leakage dose rate ≤1uSv/h X-ray Generator Tube voltage 160kV Power 480W Focal size 0.5mm Detector Image area 145mm x 145mm
ユニコンプのX線システム AX8200max 複数の測定ツール
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
AX8200max エレクトロニクスX線機 6軸360度回転オプション
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and finds broad application across industries such as BGA/CSP/Flip Chip packaging, LED and optoelectronic component manufacturing, fuse and diode production, PCB and semiconductor assembly, battery fabrication, small metal casting inspection, electronic connector modules and cable testing, and photovoltaic (PV) cell quality
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields diagram of Unicomp X-ray AX9100max Functions and Features Functions and features diagram of Unicomp X-ray AX9100max
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application fields
Unicompの輸入原料の検出装置のX線システム食品安全性の商品
Unicomp X-ray Foreign Materials Detection Equipment Food Safety Commodity Application: Food safety inspection(applicable to all kind of Meat, Fruit, vegetable etc. Inspection for metal particle,Glass chip, ceramic, stone, bone, plastic and other impurity etc. ); Commodity inspection(applicable to bags, shoes, toys, clothing, hardware accessories, electronic components etc.). Features: Easy to operate with mouse and keyboard Hi-accuracy and hi-speed image capture High
鋳造160KVのNDT Unicomp X光線システムUNC160-C-L X光線のテスト
NDT Unicomp X-Ray Systems UNC160-C-L Die Castings Pipe Inspection Features: * The implementation of automatic location detection * Automatic identification of defect detection * The unqualified product identification marking * OK and NG are sorting and recognition * High contrast, high quality image detection * Extended-modular design, strong, automatic loading and unloading * Adopt the design of transmission mechanism of high speed positioning, multi axis motion detection
