CSEAC 2026 | UNICOMP Invites You to Explore Platform‑based Intelligent Inspection for Semiconductor Packaging & Testing

CSEAC 2026 & UNICOMP
August 31 – September 2
The 14th Semiconductor Equipment, Materials and Core Parts Exhibition (CSEAC 2026)
was held at Wuxi Taihu International Expo Center.

Covering an exhibition area of over 70,000 ㎡, this edition of CSEAC has drawn continuous participation from enterprises across the United States, Japan, South Korea, Germany, Italy and other countries and regions. More than 1,400 domestic and overseas exhibitors have gathered at the event, covering sectors including wafer‑fabrication equipment, packaging & testing equipment, core components and semiconductor materials.

UNICOMP (Booth: Hall A3‑107) makes a high‑profile appearance with its AI‑powered nanometer‑scale non‑destructive‑testing technology. The solution breaks through tough defect‑detection bottlenecks in processes such as 3D / System‑in‑Package (SiP) and IC wire bonding, enabling customers to advance toward zero‑defect intelligent manufacturing.

AX9500
Near‑Nanoscale Industrial 3D/CT

Integrating four imaging modes (2D / 2.5D / Cone‑beam CT / Planar CT), the system detects critical defects such as wafer bump bridging, chip cold welding and voids in MEMS fabrication for wafer‑level and advanced‑packaging applications, to meet diversified requirements across customer scenarios.

AX9600
Open‑Tube X‑RAY Intelligent Inspection System for Semiconductors

Featuring full‑function 2.5D capability and 360° omnidirectional XY‑axis inspection, the system delivers dead‑zone‑free analysis of hidden defects beneath chips, including solder voids, interconnect bridging and cracks.

Full‑series In‑house R&D Lays a Solid Foundation for Domestic Substitution

UNICOMP’s self‑developed UNMS X‑ray source series covers the complete voltage spectrum from 90kV to 230kV, with both sealed‑tube and open‑tube technical routes. It not only safeguards the performance ceiling and delivery stability of UNICOMP’s inspection equipment, but also provides vital support for the independent and controllable domestic semiconductor‑equipment industrial chain.

Platform‑oriented Collaboration for Multi‑Modal Intelligent Inspection

UNICOMP is exhibiting alongside SSTI, SEMICAPS Semiconductor and Yifeng Electronics, empowering the upgrading of semiconductor packaging and testing through platform‑based intelligent inspection services.

Meanwhile, at the Special‑Topic Forum on Metrology Technology and Equipment, Julian Pan, CEO of Saimeikang Semiconductor (a UNICOMP‑held subsidiary), was invited to deliver a presentation on the evolution trends and implementation roadmap of optical‑inspection solutions at wafer and die levels, offering cutting‑edge insights into defect diagnosis for advanced‑packaging processes.

Nanoscale Precision Delivers Reliable Packaging &‑Testing Quality

Moving forward, UNICOMP will continue to pursue its development goal of building “a platform‑based enterprise for global intelligent‑inspection technologies and high‑end inspection equipment”, delivering one‑stop solutions covering multi‑modal inspection technologies for customers.