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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX9100max
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: LC、T/T
供給能力: 100set/montrh
製品概要
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

製品詳細

ハイライト:

Unicomp AX9100max X-ray inspection system

,

Flip-Chip BGA X-ray machine

,

FCBGA packaging analysis equipment

Monitor: 27 インチ HD ディスプレイ
System OS: Windows10 64ビット
Hard Disk: 1TB
RAM: 16g
CPU Model: I7
製品説明
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
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5.0
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★★★★★
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  • J
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    United States Jan 21.2026
    ★★★★★
    ★★★★★
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