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家 / 製品 / 電子工学X光線機械 / Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp
品質 Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp 工場
品質 Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp 工場
品質 Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp 工場
品質 Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp 工場
品質 Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp 工場
品質 Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp 工場
品質 Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp 工場

Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX9100max
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: LC、T/T
供給能力: 月30セット
タグ

x ray equipment

electronics x ray system

electronic inspection equipment
製品概要
AX9100MAX X-Ray Inspection System Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconduc...

製品詳細

ハイライト:

X-ray machine for mouse scroll wheel inspection

,

Clear inner structure scanning X-ray machine

,

Defect inspection X-ray machine AX9100max
Machine Type: 半導体電子X線検査装置
Model: AX9100max
X-Ray Tube Type: 密閉型
Voltage: 130kV
Pixel Size: 84μm
Pixel: 1536*1536
Footprint: 1450(W)×1765(D)×1835(H)mm
製品説明
AX9100MAX X-Ray Inspection System Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery assemblies. It also
総合評価
5.0
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE

Mr. James Lee

Marketing Director

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