logo
お待たせしました Unicomp Technology
+86-13502802495
家 / 製品 / 電子工学X光線機械 / General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection
品質 General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection 工場
品質 General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection 工場
品質 General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection 工場
品質 General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection 工場
品質 General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection 工場
品質 General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection 工場
品質 General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection 工場
品質 General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection 工場

General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection

基本プロパティ
原産地: 中国
ブランド名: Unicomp
認定: CE
モデル番号: AX9100vs
取引物件
最低注文数量: 1個
価格: can negotiate
支払い条件: T/T、L/C
供給能力: 月30セット
PDF
AX9100vs.pdf
タグ

x ray equipment

electronics x ray system

electronic inspection equipment
製品概要
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded ...

製品詳細

ハイライト:

PCBA X-ray inspection machine

,

X-ray machine for solder void detection

,

UNICOMP AX9100VS X-ray machine
Name: Unicomp X線 AX9100vs 多モード 3D マイクロフォーカス X線分析検査システム
Footprint: 1400 (L) × 1720 (W) × 1800 (H) mm
Machine Weight: 2925kg
Power: 4.5KW
Tube Type: チューブを閉じる
製品説明
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded Plastic; Ceramic Products and other special industries. Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis manipulation with any
総合評価
5.0
★★★★★
★★★★★
最近の50件のレビューに基づいて
最高
100%
4つ星
0
3つ星
0
2つ星
0
星1つ
0
すべてのレビュー
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE

Mr. James Lee

Marketing Director

関連製品

問い合わせを送る