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家 / 製品 / 電子工学X光線機械 / Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP
品質 Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP 工場
品質 Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP 工場
品質 Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP 工場

Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX8300
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: T/T、L/C
供給能力: 月30セット
タグ

x ray equipment

electronics x ray system

electronic inspection equipment
製品概要
Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...

製品詳細

ハイライト:

Bubble Ratio Measurement X-ray machine

,

SMT electronic component inspection X-ray

,

BGA inspection X-ray machine AX8300
Product Name: AX8300
Dimension: 1215*1325*1700(mm)
Power Supply: 220V、50Hz/60Hz 4A
Weight: 1350kg
Voltage: 110kV
Warranty: 1年
製品説明
Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient
総合評価
5.0
★★★★★
★★★★★
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE

Mr. James Lee

Marketing Director

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