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IC BGA CSP QFN Packaging Inspection X-ray AX8300MAX UNICOMP 4K Flat Panel Detector

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX8300MAX
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: T/T、L/C
供給能力: 月30セット
製品概要
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality ...

製品詳細

ハイライト:

BGA packaging inspection X-ray machine

,

CSP X-ray detector with 4K resolution

,

QFN X-ray machine with flat panel

Model: AX8300MAX
Motion Control Mode: マウス、キーボード、ジョイスティック
Tilt And Rotation: 検出器片側傾斜最大60°
Monitor: 27 インチ HD 4K ディスプレイ
System OS: Windows11 64ビット
Power Consumption: 900W
Tube Type: 密閉
製品説明
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection
総合評価
5.0
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    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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