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家 / 製品 / 電子工学X光線機械 / Detector Max 60° Tilt 360° Rotary Stage BGA AX8300MAX Unicomp HIP Head‑In‑Pillow Inspector
品質 Detector Max 60° Tilt 360° Rotary Stage BGA AX8300MAX Unicomp HIP Head‑In‑Pillow Inspector 工場
品質 Detector Max 60° Tilt 360° Rotary Stage BGA AX8300MAX Unicomp HIP Head‑In‑Pillow Inspector 工場
品質 Detector Max 60° Tilt 360° Rotary Stage BGA AX8300MAX Unicomp HIP Head‑In‑Pillow Inspector 工場

Detector Max 60° Tilt 360° Rotary Stage BGA AX8300MAX Unicomp HIP Head‑In‑Pillow Inspector

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX8300MAX
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: T/T、L/C
供給能力: 月30セット
タグ

x ray equipment

electronics x ray system

electronic inspection equipment
製品概要
AX8300MAX X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconduc...

製品詳細

ハイライト:

BGA detector with 360° rotary stage

,

X-ray machine for head-in-pillow inspection

,

AX8300MAX detector with 60° tilt
Motion Control Mode: マウス、キーボード、ジョイスティック
Tilt And Rotation: 検出器片側傾斜最大60°
Monitor: 27 インチ HD 4K ディスプレイ
System OS: Windows11 64ビット
Power Consumption: 900W
製品説明
AX8300MAX X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special
総合評価
5.0
★★★★★
★★★★★
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE

Mr. James Lee

Marketing Director

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