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High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX9100max
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: LC、T/T
供給能力: 月30セット
製品概要
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...

製品詳細

ハイライト:

PCBA BGA solder test X-ray equipment

,

SMT IC inspection X-ray machine

,

high resolution X-ray equipment for PCBA

Machine Type: 半導体電子X線検査装置
Model: AX9100max
X-Ray Tube Type: 密閉型
Pixel Size: 84μm
Pixel: 1536*1536
Footprint: 1450(W)×1765(D)×1835(H)mm
製品説明
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification. Applications BGA,
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    United States Jan 21.2026
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