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High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX9500
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: T/T、L/C
供給能力: 月あたり 300 セット
製品概要
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...

製品詳細

ハイライト:

FPD SMT X-ray inspection machine

,

BGA packaging X-ray machine

,

Unicomp AX9500 X-ray inspection

Name: UnicompのX線の点検機械
Application: SMT、EMS、BGAの電子工学、CSP、LEDのフリップ・チップ、半導体
Industry: 電子産業
X-Ray Leakage: < 1uSv="">
製品説明
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone beam CT). Applications Semiconductor industry SMT
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