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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX9500
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: T/T、L/C
供給能力: 月あたり 300 セット
製品概要
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, ...

製品詳細

ハイライト:

FPD detector BGA defect analysis

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Unicomp SMT welding system

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X-ray head-in-pillow inspection

Name: UnicompのX線の点検機械
Application: SMT、EMS、BGAの電子工学、CSP、LEDのフリップ・チップ、半導体
Industry: 電子産業
X-Ray Leakage: < 1uSv="">
製品説明
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, plus SMT welding analysis with advanced 3D tomography CT scanning capabilities. Applications Semiconductor industry inspection SMT
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