logo
お待たせしました Unicomp Technology
+86-13502802495
家 / 製品 / 電子工学X光線機械 / Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection
品質 Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection 工場
品質 Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection 工場
品質 Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection 工場
品質 Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection 工場

Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

基本プロパティ
原産地: 中国
ブランド名: UNICOMP
認定: CE, FDA
モデル番号: AX8300MAX
取引物件
最低注文数量: 1セット
価格: can negotiate
支払い条件: T/T、L/C
供給能力: 1か月あたり30セット
タグ

x ray equipment

electronics x ray system

electronic inspection equipment
製品概要
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

製品詳細

ハイライト:

Unicomp AX8300MAX X-ray inspection machine

,

BGA automated void detection X-ray

,

110KV X-ray machine for electronics
Motion Control Mode: マウス、キーボード、ジョイスティック
Tilt And Rotation: 検出器片側傾斜最大60°
Monitor: 27 インチ HD 4K ディスプレイ
System OS: Windows11 64ビット
Power Consumption: 900W
製品説明
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and

Mr. James Lee

Marketing Director

関連製品

問い合わせを送る