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bga x ray machine

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品質 SMT BGA X光線の検査システム 工場

SMT BGA X光線の検査システム

BGA X Ray Inspection Machine with integrated generator for SMT Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5μm/15μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm x 380mm X-ray Leakage

品質 所有物レントゲン撮影機80/ミクロ以下の焦点点サイズの90のKVの源のUnicompの 工場

所有物レントゲン撮影機80/ミクロ以下の焦点点サイズの90のKVの源のUnicompの

Proprietary 80 / 90 kV source with submicron focal spot size X Ray Machine FEATURES: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x

品質 BGAの結合性および分析AX9100のためのUNICOMPの金属X光線機械 工場

BGAの結合性および分析AX9100のためのUNICOMPの金属X光線機械

Metal X Ray Machine for BGA connectivity and analysis AX9100 Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

品質 無効の測定をはんだ付けするUnicomp AX9100 X光線機械SMT PCBA BGA LED QFN 工場

無効の測定をはんだ付けするUnicomp AX9100 X光線機械SMT PCBA BGA LED QFN

SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●

品質 AX7900スイッチ内部の欠陥の点検のための実時間デジタルX光線機械 工場

AX7900スイッチ内部の欠陥の点検のための実時間デジタルX光線機械

Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz

品質 AX7900電子工学の内部の欠陥の点検のための実時間デジタルX光線機械 工場

AX7900電子工学の内部の欠陥の点検のための実時間デジタルX光線機械

AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC

品質 AX7900電子工学の内部の欠陥の点検のための実時間自動オフ・ラインX光線機械 工場

AX7900電子工学の内部の欠陥の点検のための実時間自動オフ・ラインX光線機械

AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power

品質 PCBA の内部欠陥検査のためのリアルタイム デジタル X 線機械 AX7900 工場

PCBA の内部欠陥検査のためのリアルタイム デジタル X 線機械 AX7900

Unicomp factory supply quality control X-ray inspection machine for SMT industry APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC

品質 破片の内部の欠陥の点検のための実時間デジタル レントゲン撮影機AX7900 工場

破片の内部の欠陥の点検のための実時間デジタル レントゲン撮影機AX7900

Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading

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