bga x ray machine
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5 UmセミコンICの部品のためのマイクロ フォーカスのUnicomp X光線機械AX7900
5 μm Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
高解像度90kVベンチトップPCB電子部品用X線機器Unicomp AX7900
5 μm Micro focus X-Ray machines Unicomp AX7900 for semicon IC components wire bonding testing Description of AX7900 : 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
SemiconのためのSMT BGA X光線の検出装置のフリップ・チップFPDの探知器130KV
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
UnicompのIGBT Semiconのはんだ付けすることのためのインライン電子工学X光線機械3.5kW
Unicomp Inline Electronics X Ray Machine 3.5kW For IGBT Semicon Soldering Unicomp High Speed Inline 2D X-ray Inspection machine with cutting edge AI Algorithm For IGBT Semicon soldering void checking Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight
IC Semiconの点検のための5um終わりの管AX9100 Unicomp X光線機械FPD斜めの眺め
Unicomp 5μm close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Unicomp AX9180 180kV マイクロフォーカス電子X線機
Unicomp AX9180: 10μm スポット サイズ、60° チルト、7 軸リンケージを備えた 180kV マイクロフォーカス X 線。高解像度 FPD は、1000 倍の倍率で正確な PCB、BGA、半導体検査を実現します。 1 年間の保証とオフライン プログラミングが含まれます。
CX3000 BGAおよびCSPの点検のためのデスクトップの電子工学PCB X光線機械
CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
SMDケーブルの電子工学のレントゲン撮影機、Unicomp X光線の探知器AX8300 1500kg
SMD Cable Electronics Components Unicomp X-ray Detector AX8300 Model AX8300 Max kV/type 110 kV(Option90 kV)/Sealed Max.Electron beam power 25W(Option8W) Focal spot size1 7μm System magnification Up to 1000X Imaging system(Option) Flat Panel Detector Manipulator 8-axis with tilt 50 degree Measuring volume Max load area 300x300mm2 Max.sample weight 5kg Monitors 22" LCD Cabinet dimensions 1100x1100x1650mm Weight 1700kg Radiation safety2
Unicomp LX9200 をテストする PCB のための高い浸透のインライン 3D CT 機械 X 線機械
High penetration inline 3D CT machine X-Ray machine for PCB testing Unicomp LX9200 with real-time display Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type:BGA,LGA,CSP,POP,SIP... Defect type:Void,HIP,Insufficient,Bridge... Semiconductor
