bga x ray machine
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90KV 5umのmicrofocusは無効の欠陥のcheckiをはんだ付けするPCBAのための高リゾリューションFPDの管のX線の検査システムを閉めた
90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD
SMTのチップセットの抵抗の電子点検装置AX8200のX線は5gを閉めた
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
<7μm マイクロフォーカス 41X 倍率 IC 半導体コンポーネント X 線装置 AX9100 Unicomp CNC 自動検査
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 130KV 7μm X-Ray Sealed tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
自動ボイド検出高運動精度 BGA はんだ接合部 X 線装置 AX8300 Unicomp 品質管理
Unicomp X-ray Detector AX8300 The AX-8300 is professionally engineered to satisfy high-precision visual inspection requirements for PCBA assemblies.It pioneers the adoption of a customized 110kV micro-focus X-ray source within the industry, acting as an optimal intermediate-grade solution. It delivers balanced penetrating capability, effectively compensating for the insufficient energy of 90kV equipment while avoiding the excessive radiation power of 130kV models.Featuring a
5μm 110kV 密封された管 IC 半導体エレクトロニクス X 線検査機 AX8300 Unicomp 高精度
5μm 110kV Sealed Tube IC Semiconductor Electronics Xray Inspection Machine AX8300 Unicomp High Precision AX8300 is purpose-built to fulfill high-precision inspection needs for PCBA manufacturing. It features an innovative 110kV micro-focus X-ray source, uniquely developed to bridge the performance gap between standard 90kV and 130kV systems. It delivers balanced penetration power, perfectly suited for scenarios where 90kV is insufficient and 130kV is overly powerful. Powered
Unicomp X線 AX9100vs 多モード 3D マイクロフォーカス X線分析検査システム
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
Unicomp X線 AX8300VS 多モード 3D マイクロフォーカス X線分析検査システム
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
ユニコンプX線AX8300プラス半導体マイクロフォーカスX線検査機器
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
360°回転CNC自動MOSFET PCBアセンブリX線検査システムAX8300MAX Unicompの安定した性能
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,
