industrial x ray equipment
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外交問題の汚染のための自動食糧X光線の点検機械UNX6010B
High Productivity Automatic Bulk food X-Ray UNX6010B for Foreign Matters contamination inspection Applications of Food Xray UNX6010B UNX6010B is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of Food Xray UNX6010B ● Easy to Operate: one button start&stop, the optional
バルク食糧輸入原料の汚染のためのフル オートマチック スクリーンのUnicomp X光線機械
Unicomp Full-Automatic Foreign Material contamination screen X-ray Machine UNX6010B for bulk food Applications of Food Xray UNX6010B UNX6010B is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of Food Xray UNX6010B ● Easy to Operate: one button start&stop, the optional
くだらないコーヒー豆のためのUNX6010B X光線システム汚染の検出
UNX6010B X-Ray System Specialized in Contamination Detection for Bulk Raw Materials like Nuts, Coffee beans and more Applications of Food Xray UNX6010B UNX6010B is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of Food Xray UNX6010B ● Easy to Operate: one button start
ステアリングノックル X線検査機 Unicomp UNZ225 225KV NDT デジタル放射線検査機 内部裂け目
Steering knuckle X-ray inspection machine Unicomp UNZ225 225KV NDT digital radiagraphy machine for internal cracks The UNZ series is one of Unicomp Technology most popular models for aluminum casting, aerospace components and steel pipe. It offers an excellent balance of power and space sensitivity. The system can handle products up to 120cm in size while seated nicely in your failure analysis lab or busy production line. Product Features The pallet inspection platform can
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
投げる欠陥のための輸入原料の金属探知器X光線機械
Casting Defects Foreign Material Metal X Ray Detection Machine in Uzbekistan Unicomp Technology automated x-ray systems inspect steel or aluminum alloy castings expressly for the automotive industry. The automated radioscopic inspection of aluminum die castings can be performed for an audit-based or production-level scale. Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for medium•large size
Unicomp UNCT2000 電気自動車バッテリーセルハウジング亀裂検査用産業 CT マシン
High resolution industrial CT machine Unicomp UNCT2000 for electric vehicles battery cell housing cracks inspection Function Application: Equipment Features: Powerful Function: DR and CT dual system, Tomography, 3D rebulid and analysing. High Safety: Multiple safety protection measurements, meets all the international safety standards. User Friendly: User friendly system, easy operation. High Precision Inspection: High-precision mechanical transmission system, advanced image
大きさのプロダクトのための40-120kV食糧および飲料X光線の検査システム0.2-7.5mA
X-ray Inspection System for Product in Bulk Suitable for the contaminants inspection Features: Excellent operability: Automatically save product images, convenient for later analysis. Adapt to multiple product inspection: Pallets, bags, boxes, bottles, cans, loose products etc. High specification hardware configuration: The components of the equipment are imported brands to ensure the performance and service life of the whole machine. Easy to disassemble and clean: Easier
Semiconの破片の内部の欠陥の点検のための高リゾリューションのレントゲン撮影機AX8200MAX
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
