x ray detector
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5マイクロのsemiconのleadframeのテストのための閉鎖した管90kvのレントゲン撮影機Unicomp AX8200Max
5 micro closed tube 90kv X-ray machine Unicomp AX8200Max for semicon leadframe testing Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
車LEDランプのためのFlawerの探知器X光線の検査システム0.8kW BGA
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
PCBAのための携帯用1uSv/h 90kV 0.5kW X光線の点検機械
Technical Specifications Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed Power Consumption 8W Focal Spot Size 5 μm Magnification 200X Detector Detector Type FPD Resolution 101 LP/cm Effective Area 58mm×54mm System Computer Operating System Industrial PC, Win 7, i7 Processor Monitor 22” LCD Software User Interface Unicomp Multi-function DXI image processing system Working Platform Max. Loading Area 235mm×205mm Max. Inspection Area 190mm×165mm Max.
コネクターのための1.6kWオフ・ラインのプログラミングのUnicomp Xの光線AX9100
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
マザーボードのためのUnicomp X光線130kVの地図を描くMicrofocus AX9100 CNC
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
3umはSMT BGA CSPのための管1.6kW X光線機械を閉めた
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
FPDの探知器が付いているIGBT BGA QFN X光線の走査器機械AX8200MAX
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 OUR SERVICE Your inquiry will be replied in 12 hours. Original Manufacture to customers, with competitive price. We provide one year warranty, free training and whole life technology support. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you,and will give you the tracking NO. after shipment. Well-trained and Professional after-sales service team to support you. Manual will
PCB/BGA分析のためのインラインUnicomp LX9200 X線検査システム高精度
Inline High-Precision 3D X-Ray Tomography for PCB and BGA Analysis Unicomp LX9200 X-Ray inspection system Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... Semiconduc
コンデンサータ内部の欠陥検査のためのリアルタイムデジタルX線機器AX7900
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
