x ray scanning machine
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Unicomp UNCT3200 高解像度450KV 3DCT/コンピュータトモグラフィーシステム エンジンブレード鋳造物孔隙性分析
Unicomp UNCT3200 High-Resolution 450KV 3D CT/Computed Tomography System for Engine Blades Castings Porosity Analysis Product Overview UNCT3200 is a self-shielded, multi-purpose industrial CT computed tomography system designed to accommodate workpieces of various sizes and materials. This system meets industrial CT application demands across diverse industries and is specially engineered for high-precision inspection of medium and large products, including metal castings, non
110kV 密封管高精度 IC 半導体コンポーネント X 線装置 AX8300MAX Unicomp 品質管理
110kV Sealed Tube High Precision IC Semiconductor Component Xray Equipment AX8300MAX Unicomp Quality Control Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual
反対のSMT BGAの点検X光線の破片440mmのトンネルのセリウム
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
ERP MESの倉庫のデータベースの統合を用いるX光線SMDの破片のカウンターCX7000L 1.1kW
Unicomp CX7000L X-ray for SMD Chip Counter with ERP MES warehouse database integration Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows
自動Unicomp X光線のインライン破片のカウンター損傷無しより少ない労働操作
Automatic Fast Speed High Accurate Inline Chip Counter X-Ray System With No Damage And Less Labor Operation Applications: Chip counting for SMT factroy, chip manufacturer Product Features: Fast speed and high accurate Chip counting,reducing labor cost One-button operation,Automatic counting . Minimum component size 01005 System Accuracy >99.8% Count time=99.8% X-ray Leakage
Unicomp UNX4015NはAI学習技術で家禽飼料用の金属石を検査する
Unicomp UNX4015N Food And Beverage X Ray 480W For Packed Food Technical Specifications of Food Xray machine Equipment Features Dimension 1140(W)X1160(D)X1975(H)mm Machine weight 450kg X-ray tube 80-120kv/210-480W Power Supply AC 220V, 50Hz X-ray detector Diode array with 0.4mm resolution Channel size 400mm(W)*150mm(H) Conveyor Speed 10-70M/min Heavy load Conveyor Speed 10-40M/min Operating Range 5°C to 40°C (50°F to 104°F),30% to 90% relative humidity non-condensing C
強化された傾き検査 高精度 MOSFET 部品 X 線検査装置 AX8300 Unicomp 安定したパフォーマンス
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance The AX8300 X-ray inspection system is extensively deployed for circuit board and semiconductor inspection. As an offline X-ray solution, it is widely adopted in offline testing and defect analysis, ideal for PCBA, semiconductor packaging, ceramics, plastics, LED components and other precision electronic parts. System Summary Dimension 1215(W)∗1325(D)∗1700(H)mm
5μmの近い管X光線をWearable Electronics再充電可能なLithiumボタンの細胞を点検するために加えること
Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
破片チョップの分析の反対BGA X光線の点検機械マイクロBGA
Chip Counter BGA X Ray Inspection Machine Micro BGA on chop analysis X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer. OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to
