Unicomp 90KV 2D X-ray Inspection for BGA Void Analysis AX7900 The Unicomp AX7900 90KV X-ray inspection system is specifically engineered for cable terminal crimp quality assessment and comprehensive electronic component analysis, providing precise inspection capabilities for various industrial ...
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and ...
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded ...
High Accuracy X-ray Inspection System AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial ...