電子工学X光線機械
PCBA BGAのための半導体110kVの電子工学X光線機械5um AX8500
110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
SMT PCBA BGA QFNのためのCSP SMTの電子工学X光線機械110kV Unicomp AX8500
Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...
EMS BGAの空間のためにプログラム可能な5um SMT X光線装置CNC
5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
LEDの退潮のはんだのためのアルゴリズムFPDの電子工学X光線機械1.0kW
Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables...
CNC SMT BGA QFPの破裂音のパッケージのためのプログラム可能な1.0 kW X光線機械
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” ...
内部に閉じ込められた部品の抵抗の電子工学X光線機械5μm点サイズ
Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical ...
自動測定と点検するSemiconのleadframeの質のための2.5D 110kv X光線機械Unicomp AX8500
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm ...
PCBA BGA QFN LEDのはんだ付けする空間を点検するために眺めを傾けるFPD 55°の5μm Microfocus X光線
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...
Electronics SMT PCBA BGA ICのはんだ付けする質の点検のためのUnicomp AX8500 110kV 5um 2.5D X光線
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
