bga x ray machine
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エレクトロニクス産業のための高度なX線検査装置 最大負荷1000kg
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: Large Size Inspection Table,Laser Pinpoint For Precise Location Accurate Control, CNC Programming,Automatic Positioning FPD Tilting ±25° Safely Electromag
可聴周波欠陥の点検のためのUnicomp X光線の保証走査器90KV AX8200
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200ApplicationsBGA InspectionInspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
LX2000 LED SMT BGA CSPを点検するオンラインX光線の検出装置の灰色色
LX2000 Online X-ray Detection Equipment Checking LED SMT BGA CSP The LX-2000 is a versatile OnLine X-ray Machine designed for automated and semi-automated analysis. In addition to the OnLine capability, the LX-2000 can also be used in a Manual mode as a process monitoring/engineering workstation. High resolution x-ray images are generated using a closed microfocus 130kV tube with leading edge FPD (Flat Panel Display) detectors. This imaging chain combination is excellent for
BGAの点検X光線装置22" CNCのプログラム可能な検出機能のLCD
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC programmable detection Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient
電源消費量1.0KWのPCB用X線検査装置 1280L x1220W x1615H mm
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Inspection Table of Large Dimensions, Laser Pinpointing for Exact Positioning Precise Control
電子産業 電子産業 線 1280x1220x1615mm の X線検査装置
X-Ray Inspection Equipment for Electronics Description of IC X Ray machine AX7900: It is broadly utilized in a variety of fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, the Photovoltaic Industry, among others. APPLICATION of IC Xray machine AX7900: Large-Scale Inspection Table with Laser Pinpointing for Precise Localization High-Precision
ユニコンプ AX8300H X線検査装置 (110kVマイクロフォーカスX線源、高解像度FPD搭載)
AX8300H 110kV マイクロフォーカス線源と 360° 回転を備えた X 線検査。 BGA、CSP、半導体分析用の高解像度 FPD 検出。 FDA の安全基準を満たしており、漏洩量は 1μSv/h 未満です。
SMDケーブルの電子工学の部品のための高性能のUnicomp X光線の探知器AX8300
SMD Cable Electronics Components Unicomp X-ray Detector AX8300 The AX-8300 is designed to address PCBA high resolution inspection requirements. The AX-8300 is the FIRST machine in the industry to utilize a special 110kV micro focus x-ray source! This is the Perfect “In Between” design that offers a solution when 90kV is not enough energy and 130kV is too much. Using a state of the art FPD (Flat Panel Display) detection, the AX-8300 can generate extreme high magnification
5μmの近い管X光線をWearable Electronics再充電可能なLithiumボタンの細胞を点検するために加えること
Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging
